High-Density Two-Phase Liquid Cooling for AI Workloads
BDE and Accelsius bring NeuCool® direct-to-chip cooling to the Mid-Atlantic and Gulf South—enabling 250kW+ per rack with zero liquid damage risk.
Core Value Highlights
Extreme Density
Cool 250kW+ racks and 4500W+ per socket to support next-gen GPU clusters.
Zero Fluid Risk
Uses non-conductive dielectric refrigerant that harmlessly evaporates if leaked—protecting high-value silicon.
Maximum Efficiency
Eliminates white-space water usage and slashes energy costs to push PUE toward 1.0.
Transition from Legacy Air to AI-Ready Liquid Cooling
As AI and HPC push power demands beyond traditional air-cooling capabilities, Blackstar Diversified Enterprises (BDE) partners with Accelsius to deliver turnkey thermal management.NeuCool® utilizes direct-to-chip, two-phase cooling to absorb extreme thermal loads without relying on water in the white space. BDE handles complete integration—from system architecture through commissioning—ensuring seamless deployment across the Gulf South and Mid-Atlantic regions.
MR250 In-Row CDU
Two-phase liquid cooling CDU delivering up to 250kW of rack cooling capacity for high-density AI compute environments.
Key points: • Row-based CDU architecture • Supports 1-2 racks up to 250kW • Two-phase cooling for extreme density
We don't just supply hardware—we guarantee operational readiness:
System Architecture: Tailored engineering for new builds or retrofits. Thermal Pre-Testing: Load simulation (LSS) and TSR testing before GPU installation. Regional Support: North American supply chain backed by local BDE field engineers.
Ready to scale your AI cooling infrastructure?
Work with BDE’s mission-critical team to design, test, and deploy Accelsius two-phase cooling in your facility.